Non-destructive inspection below the surface
Micron-resolution imaging inside materials — no contact, no damage, no ionizing radiation
The problem
Surface inspection sees only the surface. Voids under a coating, foreign matter between electrode layers, delamination inside a composite — by the time they show on the surface, the loss has happened.
Existing methods each carry a cost: ultrasound penetrates deeply but resolves coarsely and usually needs a couplant; X-ray CT resolves well but the equipment is expensive, slow, and subject to radiation controls; sectioning is the most accurate and destroys the sample, so it can only ever be a spot check.
How we approach it
Optical coherence tomography uses low-coherence interferometry to obtain depth-resolved structure. It is a mature tool in biomedical imaging and has been moving steadily into industrial inspection — coatings and thin films, displays, microelectronics and PCBs, laser process monitoring.
LUC-INSIGHT™ puts that capability in a form that can sit on a line: 1–10 μm resolution, non-contact, non-destructive, no ionizing radiation.
Where it applies
Battery electrode and packaging inspection, multilayer structures in semiconductor and advanced packaging, delamination and porosity in coatings and composites.
Ready to Transform Your Application?
Partner with us to integrate cutting-edge photonic sensors into your systems