LUC-INSIGHT™ OCT Imaging

See Inside Without Destroying

LUC-INSIGHT™ brings laboratory-grade Optical Coherence Tomography (OCT) to the production floor. With 1-10 micrometer resolution, detect hidden defects that could cause million-dollar failures—all without touching your product. See through coatings, into batteries, beneath surfaces, in real-time.

The Hidden Defect Crisis

One defective battery cell can cause a $10M vehicle recall. One delaminated composite can ground an aircraft fleet. One contaminated pharmaceutical batch can cost lives. LUC-INSIGHT™ reveals what’s hidden beneath the surface, enabling 100% inspection where sampling isn’t enough.

Technical Specifications

Performance Metrics

• Axial Resolution: 1-10 μm (adjustable)
• Lateral Resolution: 5-20 μm
• Imaging Depth: Up to 10mm
• Field of View: 10×10mm to 50×50mm
• Scan Rate: 100,000 A-scans/second
• 3D Volume Rate: 10 volumes/second
• Sensitivity: 100 dB
• Dynamic Range: 50 dB
• Center Wavelength: 1310nm or 850nm
• Bandwidth: 100nm

Physical Characteristics

• Dimensions: 300 × 200 × 150 mm
• Weight: <5kg
• Power Consumption: 100W typical, 150W max
• Operating Voltage: 100-240V AC, 50/60Hz
• Laser Class: Class 1 (eye-safe)
• Operating Temperature: 10°C to +40°C
• Storage Temperature: -20°C to +60°C
• Humidity: 10-85% RH (non-condensing)
• Protection Rating: IP54
• Interface Options: GigE, USB 3.2, CoaXPress
• MTBF: >20,000 hours

Killer Applications

EV Battery Manufacturing - Prevent Thermal Runaway

A single defective cell can cause thermal runaway, destroying vehicles and lives. Current inspection uses sampling—missing 99% of cells.

Success Metrics:

• 100% inline inspection at 10 cells/second
• Detect 1μm defects through 5mm structure
• 0.3% hidden defects found that pass other tests
• $10M recall prevented per incident

ROI Impact:

• Investment: $75K per line
• Recalls Prevented: 1 = $10M saved
• Yield Improvement: 2% = $1M/year
• Warranty Reduction: 40% = $3M/year
• Payback: 2 weeks

Semiconductor Manufacturing - Zero-Defect Quality

See inside 3D chip structures without destructive analysis. Detect voids, verify alignment, measure thickness.

• Challenge: X-ray damages sensitive chips
• Solution: Optical inspection with better resolution
• Result: 100 wafers/hour with zero damage
• Value: Save $10K per test wafer

Technology Comparison

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